- Utilization of silicon nitride ceramics in the mechanical domain Silicon nitride ceramics find application in the mechanical industry as valves, pipes, sorting wheels, and ceramic cutting instruments. The most prevalent use involves silicon nitride ceramic bearing spheres.
In comparison to steel spheres, silicon nitride ceramic bearing spheres exhibit remarkable benefits: reduced density, elevated heat resistance, self-lubrication, and resistance to corrosion. They are employed in high-speed machine tool electric spindle high-velocity bearings, aerospace engine systems, wind turbine bearings, and automotive engine bearings. For equipment such as Acting as a high-speed rotating entity, the ceramic sphere generates centrifugal stress, and the low density of silicon nitride diminishes the centrifugal stress on the external ring of the high-speed revolving component.
Certainly, here’s the paragraph with synonyms:
- Utilization of silicon nitride ceramics in the semiconductor sector Besides their superior mechanical attributes, silicon nitride ceramics also showcase an array of exceptional thermal conductivity properties, rendering them suitable for deployment in the rigorous semiconductor arena. Within the realm of integrated circuits, the level of integration and power demands escalate, imposing more stringent criteria on the flexural strength, constancy, and heat dissipation abilities of packaged chip substrates.
Silicon nitride ceramic substrates exhibit heightened thermal conductivity (typical figures for commercial variants range from 80 to 90 W/mK). When contrasted with alumina substrates or ZTA substrates, their thermal conductivity surpasses threefold, and they exhibit a modest thermal expansion coefficient (2.4 ppm/K), aligning closely with semiconductor chips (Si, SiC) while maintaining excellent thermal compatibility. Furthermore, silicon nitride ceramic substrates display exceptional mechanical characteristics, taking into account elevated flexural strength and substantial fracture toughness. In comparison with alumina substrates or aluminum nitride substrates, they exhibit over twice the flexural strength, boasting a range of 600 to 850 MPa, with a fracture toughness of 5 to 7 MPa·m½. Consequently, they demonstrate an exceedingly high resistance to both cold and thermal shocks, translating into remarkable reliability. They can also effectively weld relatively thick copper metal (up to 800μm in thickness) to comparatively thin nitride on silicon ceramics. This results in elevated current-carrying capacity and excellent heat transfer. Owing to the exceptional performance of silicon nitride substrates, they hold promising prospects in power modules (IGBT/SiC power modules) for applications like rail transit, wind energy, photovoltaics, and new energy vehicles.
- Utilization of silicon nitride ceramics in the realm of bioceramics As an innovative generation of bioceramic materials, silicon nitride ceramics not only possess the exceptional attributes expected of ceramic materials but also exhibit favorable radiographic characteristics, infection resistance, biocompatibility, and osseointegration qualities. They find extensive applications in biosensors, spinal treatments, orthopedic procedures, dental interventions, and various implantations.
- Deployment of silicon nitride ceramics in the domain of wave-transmitting materials Silicon nitride ceramics and their composite counterparts boast remarkable features such as heat endurance, wave propagation, and load-bearing capacity, positioning them as a novel class of high-performance wave-transparent materials under exploration. With the introduction of pores, porous silicon nitride ceramics exhibit low density, reduced thermal conductivity, exceptional pervaporation capabilities, and effective electromagnetic wave transmission. Additionally, they present high specific strength, elevated specific modulus, resistance to high temperatures, protection against oxidation, and resilience to electromagnetic interference, making them suitable for use as ceramic-based wave-transmitting materials in the fabrication of radomes and antenna windows.