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MIDDIA High Thermal Conductivity Aluminum Nitride Ceramic Substrate and Disc Parts (Item No. AN02)

MOQ: 100 PCS
Customization: OEM Logo & Packaging Avallable
Sample Lead Time: 2-3 Days
Supply Ability: 100,000 PCS/Month

Engineered for semiconductor module packaging, high-power LED arrays, microelectronic circuits, and thermal management systems, MIDDIA AN02 Aluminum Nitride (AlN) Ceramic Substrates offer unmatched heat dissipation capability. Manufactured from high-purity aluminum nitride, this advanced ceramic material exhibits extremely high thermal conductivity (up to 170–230 W/m·K, nearly 7 to 8 times higher than standard alumina ceramic) while maintaining superior electrical insulation and low dielectric loss. Completely non-toxic, chemically stable, and non-reactive, AlN substrates feature a coefficient of thermal expansion (CTE) that closely matches silicon wafers, drastically reducing thermal mismatch stress in semiconductor die bonding. Capable of withstanding extreme temperatures and corrosive environments, these precision-ground circular discs and rectangular wafers act as ideal circuit carriers, power module heat sinks, RF/microwave dielectrics, and high-temperature insulating barriers. MIDDIA provides full OEM/ODM precision laser cutting, CNC machining, customized dimensions, and surface polishing with low MOQ wholesale orders and fast global delivery.

Factory Direct Price ISO/Custom Compliant

Details

Name
Aluminum Nitride Ceramic Structural Parts
Item No.
AN02
Material
Aluminum Nitride Ceramic
Color
White
Size
Customized

Product Usage

1. Aluminum nitride ceramics are a new type of high-tech ceramics. Aluminum nitride ceramic substrate has extremely high thermal conductivity, non-toxic, corrosion resistance, high temperature resistance, good thermochemical stability, etc. It is an ideal packaging material and heat dissipation for large-scale integrated circuits, semiconductor module circuits and high-power devices. Materials, circuit components and interconnect wire carriers. It is also the best additive to improve the thermal conductivity and mechanical properties of polymer materials. Aluminum nitride ceramics can also be used as crucibles for melting non-ferrous metals and semiconductor materials gallium arsenide, thermocouple protection tubes, high-temperature insulators, microwave dielectrics Materials, high temperature resistant, corrosion resistant structural ceramics and transparent aluminum nitride microwave ceramic products are used as raw materials for the production of high thermal conductivity ceramics and resin fillers. Aluminum nitride is an electrical insulator with good dielectric properties. The aluminum nitride coating on the GaAs surface protects it from ion implantation during annealing.
2. Used as raw materials for high thermal conductivity ceramics, raw materials for AlN ceramic substrates, resin fillers, etc.
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Ceramic Technology Co.,Ltd
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Address: Room 406, No. 388 Qishan Road,
Huli District, Xiamen City, Fujian Province, China
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